Xenon lamp aging test chamber is suitable for adaptability tests of electrical, electronic, and other materials in storage, transportation, use, and other aspects in simulated natural environments. It is an experimental instrument for material weathering aging tests.

1. Knocking and hand pressure method: The instrument runs well and badly. Most of these phenomena are caused by unstable contact or false soldering. For this, the knocking and hand pressure methods can be used. "Knocking" means tapping the plug-in board or component with a small eraser head or other knocking in the place where the fault may occur to see if it will cause errors or shutdowns. What we call "hand pressure" means that when a fault occurs, after turning off the power supply, the plug and the socket are re-pressed by hand, and then turned on to see if the fault can be eliminated. If it is found that it is normal to knock on the casing, but it is not normal to knock again, first reinsert all the connectors and try again. If it does not succeed, you have to find another way.

2. Observation method: Use vision, smell, and touch. Sometimes, damaged components will change color, bubble, or have burnt spots, burnt devices will produce some special smells, and short-circuited chips will burn the virtual solder or desoldering places, which can also be seen with the naked eye.

3. Temperature rise and fall method: Sometimes, the instrument works for a long time, or when the working environment temperature is high in summer, it will fail. It is normal to shut down and check, and it is normal to restart after stopping for a period of time, and the fault will occur again after a while. The reason for this phenomenon is that the performance of individual ICs or components is poor, and the high-temperature characteristic parameters do not meet the index requirements. In order to find the cause of the fault, the temperature rise method can be used. The so-called cooling means that when a fault occurs, use cotton fiber to rub the * to the place where the fault may occur, cool it down, and observe whether the fault is eliminated. Heating is to artificially increase the ambient temperature, such as putting an electric soldering iron on a suspicious part (be careful not to raise the temperature too high to damage normal devices) to see if the fault occurs.

4. State adjustment method: Under normal circumstances, do not touch the components in the circuit casually before the fault is determined, especially the adjustment type devices, such as potentiometers. However, if a re-reference measure is taken in advance (for example, mark the position or measure the voltage or resistance value before touching), it is still allowed to touch. Maybe sometimes the fault disappears after the change.

5. Isolation method: The fault isolation method does not require comparison of the same model of equipment or parts, and has reliable performance. Based on the fault detection flow chart, segmented encirclement gradually narrows the fault search range, and combined with signal comparison, component exchange, and other methods, the fault can generally be found quickly.

6. Elimination method: The so-called elimination method is to determine the cause of the fault by plugging and unplugging some plugs and devices in the plug and unplugged. After some plug-in boards or devices are unplugged, the instrument returns to normal, indicating that a fault has occurred.